中文 | ENGLISH
HOME
About us
Staff style
Company dynamics
ABOUT US
MICRO ASSEMBLY
  • REK VACUUM SOLDERING SYSTEM
    SC-350
  • HERMETIC SEALING SYSTEMS
    Projection Welders
    Glovebox Welding Enclosure
    Glovebox Welding Enclosure
    Parallel seam sealer
  • F&S WIRE BONDER
    58xx wire bonder
    53xx wire bonder
  • TRESKY SEMI AUTO SYSTEM
    T-8000-G
    T-6000-L/G
    T-6000-L
  • TRESKY AUTOMATIC SYSTEM
    T-5100、T-5100-W
    T-5300、T-5300-W
    T-3000-PRO&T-3002PRO
    T-4909-AE
Diamond/SiC
  • Microwave Plasma Chemical Vapor Deposition
    MPCVD(Microwave Plasma Chemical Vapor Deposition)
TEST AND INSPECTION
  • NORDSON DAGE BONDTESTER
    4000 Plus Bondtester
    Stellar 4000 Bondtester
  • SONOSCAN ACOUSTIC MICRO IMAGE
    AMI D9650Z
    AMI D9650
    AMI Gen7
    AMI AW 300
  • YXLON X-RAY INSPECTION
    YXLON FF35 CT
    YXLON Cougar EVO Series
    YXLON Cheetah EVO Series
  • CYBER 3D SURFACE MEASUREMENT SYSTEM
    Non-contact surface metrology system
    Non-contact surface metrology system
FOR WAFER
  • ZW MPCVD
    Microwave Plasma Chemical Vapor Deposition
  • TRION PECVD/RIE/PR STRIPPING
    Cluster Plasma Etch/Deposition System
    Fully automated plasma system
    Multiple Process Module Stripper
    Single Process Module Stripper
  • THERMCO DIFFUSION,ANNEAL,LPCVD
    Thermco Model 5100 & 5200 Furnaces
  • TEMESCAL VACUUM COATING SYSTEM
    UEFC-4900/5700 E-beam Coater
    FC-3800/4400 E-beam Coater
    FC/BCD-2800 E-beam Coater
    BJD/FC-2000 E-beam Coater
PRODUCT
MPS LAB
Exhibition News
EXHIBITION NEWS
CONTACT US
Recruitment
Message
CONTACT US
MICRO ASSEMBLY
REK VACUUM SOLDERING SYSTEM
HERMETIC SEALING SYSTEMS
F&S WIRE BONDER
TRESKY SEMI AUTO SYSTEM
TRESKY AUTOMATIC SYSTEM
Diamond/SiC
Microwave Plasma Chemical Vapor Deposition
TEST AND INSPECTION
NORDSON DAGE BONDTESTER
SONOSCAN ACOUSTIC MICRO IMAGE
YXLON X-RAY INSPECTION
CYBER 3D SURFACE MEASUREMENT SYSTEM
FOR WAFER
ZW MPCVD
TRION PECVD/RIE/PR STRIPPING
THERMCO DIFFUSION,ANNEAL,LPCVD
TEMESCAL VACUUM COATING SYSTEM
  • SC-350
  • Reactive Ion Etch (RIE) System
  • Parallel seam sealer
  • Parallel seam sealer
  • Glovebox Welding Enclosure
  • Glovebox Welding Enclosure
  • Projection Welders
  • Non-contact surface metrology system
  • Non-contact surface metrology system
  • BJD/FC-2000 E-beam Coater
  • Thermco Model 5100 & 5200 Furnaces
  • Fully automated plasma system
Product list
Home >>> Product Class >>> FOR WAFER
More detailed product classification
ZW MPCVD   TRION PECVD/RIE/PR STRIPPING   THERMCO DIFFUSION,ANNEAL,LPCVD   TEMESCAL VACUUM COATING SYSTEM  
  • UEFC-4900/5700 E-beam Coater
    UEFC-4900/5700 E-beam Coater
  • FC-3800/4400 E-beam Coater
    FC-3800/4400 E-beam Coater
  • FC/BCD-2800 E-beam Coater
    FC/BCD-2800 E-beam Coater
  • BJD/FC-2000 E-beam Coater
    BJD/FC-2000 E-beam Coater
  • Thermco Model 5100 &  5200 Furnaces
    Thermco Model 5100 & 5200 Furnaces
  • Cluster Plasma Etch/Deposition System
    Cluster Plasma Etch/Deposition System
  • Fully automated plasma system
    Fully automated plasma system
  • Multiple Process Module Stripper
    Multiple Process Module Stripper
  • Single Process Module Stripper
    Single Process Module Stripper
  • Plasma Enhanced Chemical Vapor Deposition(PECVD) System
    Plasma Enhanced Chemical Vapor Deposition(PECVD) System
  • Reactive Ion Etch (RIE) System
    Reactive Ion Etch (RIE) System
  • Microwave Plasma Chemical Vapor Deposition
    Microwave Plasma Chemical Vapor Deposition
  • About us
  • Product
  • MPS LAB
  • Exhibition News
  • Contact Us
  • About us
  • Staff style
  • Company dynamics
  • MICRO ASSEMBLY
  • Diamond/SiC
  • TEST AND INSPECTION
  • FOR WAFER
  • MPS LAB
  • 测试001
  • Contact us
  • Recruitment
  • Message
Copyright@ 2003-2025  Micro-Power Scientific Co., Ltd.  Copyright   Tel : Fax: Address: PostCode:
  causeResponsible for network promotion