Product data
T-4909-AE
brief introduction：

The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.
Product details

For the past 40 years, Dr. Tresky AG has been perfecting the art of creating die bonding /pick & place systems.

The T-4909-AE anniversary edition is a manual, budget sensitive die bonder with superior ergonomic design. As with all of Tresky’s products, the T-4909-AE incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Bonding parameters and sequences, intuitively programmable by an integrated Raspberry PC with touchscreen.


Excellent performance, ergonomically designed and high reliability makes the T-4909-aE ideal for small and medium volume production.



applications:


  • Die Attach, 
  • Flip-Chip, 
  • MEMS,
  • MOEMS, 
  • VCSEL, 
  • RFID, 
  • Adhesive Bonding, 
  • Eutectic Bonding,
  •  ......


Technical Data:

XY- Movement (placement stage):180mm x 180mm (manual)
Z- Movement:95mm (manual)
Spindle Rotation:360° (unlimited)
Bond Force:20g - 1000g
Placement accuracy:±10µm (operator/process depending)
Flip-Chip Placement accuracy:±5µm Option (operator/process depending)
Connections:Compressed air 5 - 6 bar / Vacuum 0.6 bar (abs)
Dimensions:755mm x 730mm x 500mm
Weight:33kg

Voltage:110V / 220V






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