Product data
T-3000-PRO&T-3002PRO
brief introduction：

The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

Product details
        The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate.

        The T-3002-PRO is equiped with Tresky's die ejector system for pick-up from wafer.


applications:

  • Die Attach, 
  • Die Sorting, 
  • Flip-Chip, 
  • 3D Packaging, 
  • MEMS, 
  • MOEMS,
  • VCSEL, 
  • Photonics, 
  • Ultrasonic, 
  • Thermosonic,
  • RFID,
  • Sensor Assembly, 
  • Adhesive Bonding, 
  • UV Curing, 
  • Eutectic Bonding (AuAu, AuSn, .....),


Technical Data:

XY- Movement (placement stage):220mm x 220mm (manual)

XY- Movement (wafer stage):220mm x 220mm (manual)
Z- Movement:95mm (automatic)
Spindle Rotation:360°
Bond Force (standard range):20g - 400g (other force ranges available)
Bond Force (repeatability):±1g
Z-Measurement resolution:±0.001mm
Max. PC Board-/ Substrate Size:400mm x 280mm
Placement accuracy:±10µm; ±1µm optional (process depending)
Connections:Compressed air 5 - 6 bar / Vacuum 0.6 bar (abs)
Dimensions:900mm x 800mm x 700mm
Weight:90kg
Voltage:110V / 220V



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