Product data
Thermco Model 5100 & 5200 Furnaces
brief introduction:

Thermco’s Model 5100 and 5200 Diffusion Furnace are four-process chamber systems used for processing Semiconductor, PV , LED,Nano and MEMS substrates up to 150 mm in diameter. The only difference between the two models is the length of available flatzone, with the 5200 series having greater wafer processing capacity. Each chamber can accommodate process tubes up to 10 inches (251 mm) in diameter.

Product details


Characterised Processes:


• Silicon Nitride (standard)
• Silicon Nitride (low stress)
• Ramped Temp Polysilicon
• Uniform grain Polysiliccon
• TEOS
• VLTO
• BPSG
• High temperature Oxide (HTO)
• Dry Oxide
• Wet Oxide
• POCl3 or BBr3
• Forming gas anneal
• H2 anneal (with 100% H2)
• High temperature drive in
• Alloy or low temp anneal
• H2 anneal (with 100% H2)

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