Product data
Stellar 4000 Bondtester
brief introduction:

STELLAR 4000 is the platform of choice for all manually operated pull and shear production bond testing. Configure as a simple bond wire pull tester, or upgrade for ball shear, die shear, bump pull, and tweezer pull testing.

Product details
STELLAR 4000
Industry Leading Precision
Whether you utilize one Bondtester in production or many, STELLAR 4000 ensures ultimate
system to system consistency so pass/fail decisions are the same, regardless of the
Bondtester used.
• Patented frictionless load cartridge technologies guarantee
accuracy, repeatability and correlation.
• Rugged, high quality frame is built to last, ensuring years of smooth operation.
• Conforms to industry testing standards and compatible with 4000 series cartridges.
Maximum Operator Comfort
STELLAR 4000 is extremely easy and comfortable to use so operators can test for prolonged
periods without risk to their health.
• Working heights, and controls designed with the operator in mind.
• Soft, padded arm rests ensure STELLAR 4000 is a pleasure to use.
• Antivibration optics, and dimmable lighting reduce eye strain during long sessions.
Perfect for Semiconductor
STELLAR 4000 is designed specifically for the needs of semiconductor manufacturing.
• Clean room friendly, enclosed design.
• Assessed to SEMI S2 environmental health and safety, and SEMI S8 ergonomic standards.
• Fast setup and intuitive ParagonTM Lite software ensures you can release into
production quickly.
Key Features
Software Paragon Lite
PC connection  Ethernet 
Air supply safety Tool protection & air warning
EMO switch position   Left keypad
Illumination  Software dimmable LED
Table type Integrated & enclosed
Semiconductor Testing Standards
Bump shear

JESD22-B117B

JEITA-ET-7409

Cold bump pull

JESD22-B115A

JEITA-ET-7409

Die shear

MIL-STD-883

IPC-TM-650

Performance
Step back accuracy

+/- 1 µm 

 

System accuracy +/ - 0.25 % FSL
Axis travel (X x Y x Z) 100 mm x 100 mm x 65 mm             
XY speed and resolution  Up to 2 mm/s, 500 nm 
Z speed and resolution  5 mm/s, 250 nm 
Semi Packing Testing Standards
Ball bond shear

MIL-STD-883

ASTM-F129

JESD22-B116B

Wire pull

MIL-STD-883

IPC-TM-650

Installation 
Footprint (W x D x H ) 705 mm x 562 mm x 675 mm
Weight  86 kg 
Power supply  100 - 240 VAC single phase
Pneumatic supply Min 4.0 bar
Certification 
SEMI standards S2 & S8
CE compliance Machinery, EMC & RoHS
Factory accreditation         ISO 9001:2015
Environmental  ROHS (2011/65/EU)

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