Product data
SC-350
brief introduction：

As a high efficiency production tool used for vacuum reflow soldering. The REK SC series comes standard with formic acid bubblers and high vacuum assembly which guarantees the best reflow soldering results . Technical data: vacuum level＜5E-2mbar、ultimate vacuum 5E-6mbar、maximum temperature 1000℃、heating rate 270K/min、cooling rate 150K/min、temperature uniformity 1%

Product details
As a high efficiency production tool used for vacuum reflow soldering. The REK SC series comes standard with formic acid bubblers and high vacuum assembly which guarantees the best reflow soldering results . Technical data: vacuum level＜5E-2mbar、ultimate vacuum 5E-6mbar、maximum temperature 1000℃、heating rate 270K/min、cooling rate 150K/min、temperature uniformity 1%

A selection of processes available in our systems:
die-attach 
Substrate soldering
Package sealing
T/R modules 
Wafer bump reflow
Wafer level packaging

Brazing





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