UEFC-4900
The UEFC-4900 is the compact version of the UEFC-5700.
This system features source-to-substrate and chamber angles that have been optimized for 150mm wafer production.
The Ultimate Mid-sized Tool
The UEFC-4900 is the ultimate high-uniformity mid-sized coater for lift-off processes. The Auratus methodology increases the effective deposition rate, enabling customers to produce wafers faster. Compared with conventional box coaters, the UEFC-4900 provides:
• Large capacity 25 x 150 mm wafers
• 40% more wafers with no increase in footprint or power consumption
• Less than 15 minutes to 5E-07 Torr
• 36,500 L/sec pumping
• Significantly less surface area and volume
UEFC-5700
The UEFC-5700 is the first Temescal system to incorporate the Auratus deposition process enhancement methodology, dramatically improving lift-off coating processes.Experience near-perfect uniformity with minimal or no uniformity masking while reducing material consumption by as much as 40%.
Ultra-High Throughput Tool
The UEFC-5700 is the ultimate high-throughput coater for lift-off processes. The Auratus methodology increases the effective deposition rate, enabling customers to produce wafers faster. Compared with conventional box coaters, the UEFC-5700 provides:
• Large capacity 42 x 150 mm wafers
• 40% more wafers with no increase in footprint or power consumption
• Less than 10 minutes to 5E-07 Torr
• 44,000 L/sec pumping
• Significantly less surface area and volume
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