T-5100

PC controlled Manual Die Bonder

The T-5100 is the successor of the proven and well known T-3000-M series with many features of the PRO-series. It is an universal workhorse for a wide range of micro-assembly tasks. The manual operation makes it so very flexible and adaptable to many tasks in the R&D area, and it is just as popular for small-scale and pilot production.

The extremely rigid machine, with its completely redeveloped base is compact and fits on a lab desk. It can be expanded with many different modules to cover an enormous range of applications.Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of wellthought out features like a true, linear Z-Axis, Force Control, XY Fine Control and high-resolution optics that allow flip-chip placing down to sub-micron accuracy.

T-5100-W

PC controlled Manual Die Bonder

Unique pick-up from wafer

The T-5100-W version features the same flexibility than the T-5100 and has the additional advantage of handling wafers, which sits below the main table with Tresky’s pneumtatic die ejection system.

The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the T-5100-W incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the platform is the industry’s most sophisticated system in its class and with the new intuitive software even easier to operate.

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