The 58xx series:
The Gold wire Ball-Wedge
version of the automatic wire
bonders in our Series 58xx
featuring exchange able bond
heads.
A fully automatic mode
makes it ideally suited for
medium-scale production.
Parts to be bonded are fed
manually by the operator,
but the bonds are produced
completely without operator
influence.
Thanks to the built-in pattern
recognition. Single bonds can
be made within seconds,
making the machine perfect
for R&D, Pilot manufacturing
and middle volume
production
5810
Bond System
Wire types Gold wire 12,5-50μm on 2’’ spool
Bondhead Ball-Wedge for gold wire
Standard capillaries 16mm length (optionally 19 mm)
Ultrasonic F&S Generator 67kHz
System (optional 120, 130, 140kHz)
Bonder Base
Axes
• Working area X/Y-axis 200 x 150 mm;
• Programmable step resolution 1μm
• Programmable Z axis with 100 mm stroke;
Hardware
• Dual-Core PC with Windows OS, Ethernet,
• USB 2.0/3.0, Colour Display 22”
• GigE-CCD-Colour Camera, 5 Mpixel
• Fully networkable in TCP/IP servers
Software
• From single bonds up to complex programmes,
• Loop shapes can be saved in libraries
• Optional pattern recognition
Control
• high-performance embedded ARM-System with
Real-time operating system for precision
• 1 wire / second
Placement accuracy: +/- 5μm @ 3 sigma, incl. Tool / no wire
on F & S Bondtec standard substrate
Repeatability: +/- 3 μm @ 3 sigma, incl. Tool / without wire
on F & S Bondtec standard substrate
Loop height accuracy: +/- 5μm @ 3 sigma, for thin wire 5830
with 25μm aluminum wire on F & S Bondtec
standard substrat
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