Product data
Plasma Enhanced Chemical Vapor Deposition(PECVD) System
brief introduction：

Trion manufactures a variety of plasma etch and deposition systems for the Compound Semiconductor, MEMS, Opto-Electronic and other markets. Our products feature the smallest footprint and lowest cost systems in the industry with proven production reliability.

Product details

ORION III PECVD

The Orion III Plasma Enhanced Chemical Vapor Deposition (PECVD) system is designed to supply laboratories and pilot line production environments with state-of-the-art deposition capability using single wafers, dies or parts up to 300mm.

The Orion III system is used for non-pyrophoric PECVD processes.

Films deposited: oxides, oxynitrides, nitrides and amorphous silicon. 

Process gases: <20% silane, ammonia, TEOS, diethylsilane, nitrous oxide, oxygen and nitrogen.

An ICP or Triode source is offered as an option for this tool. TheTriode allows the user to create higher density plasma and thereby
control film stress.
Samples are loaded into the process chamber by opening the lid
and placing wafers on the electrode surface, or “chuck.”
Leave a message for product
Title
Contact
Tel
Content
Verify Code
Click to change
Note：1. Shortcut key for send message :Alt+s or Ctrl+Enter!
2. If necessary, please leave your detail contact!
Related products