Service scope
Micro-Power Scientific Co., Ltd. was established in Beijing in 2001 to provide process equipment, materials and technical solutions for semiconductor and electronic manufacturing. There are technical support and after-sales service centers in Shanghai, Suzhou, Shenzhen, Chengdu, Xi'an,Wuhan and Yantai.
Recommended products
MPS LAB
MPS laboratory has many prototype displays, which can provide customers with operation demonstration, training, process evaluation, OEM cooperation and sales.

F&S 53xxBDA wire bonding machine
Applicable to 17~50 μ M gold wire ball welding, 17~75 μ M gold/aluminum wire deep cavity wedge welding, 25x12.5um~250x25um gold belt bonding
F&S 5330 wire bonding machine is suitable for 17~75um gold/aluminum wire bonding

F&S 5350 lead bonding machine is applicable to 100~500 μ M thick aluminum wire bonding

F&S 58xx series tabletop fully automatic wire bonder 5810 is applicable to 17~50 μ M gold wire ball welding 5830 is applicable to 17~75um standard wire feeding wedge welding


F&S 5600CS Full-automatic tensile and shear force tester
It is applicable to the full automatic test of the maximum 100g or 5kg lead tension and the maximum 500g or 5kg ball/chip shear force

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